This post is a growing collection of commonly used acronyms in VLSI and semiconductor technology, along with their full forms. Keep checking back for updates!
General VLSI & Semiconductor Terms:
- CMOS - Complementary Metal-Oxide-Semiconductor
- ASIC - Application-Specific Integrated Circuit
- FPGA - Field-Programmable Gate Array
- RTL - Register Transfer Level
- HLS - High-Level Synthesis
- VHDL - Very High-Speed Integrated Circuit Hardware Description Language
- HDL - Hardware Description Language
- SoC - System-on-Chip
- NoC - Network-on-Chip
- DSP - Digital Signal Processing
- RISC - Reduced Instruction Set Computing
- IP - Intellectual Property
Fabrication & Process Technology:
- MOSFET - Metal-Oxide-Semiconductor Field-Effect Transistor
- BJT - Bipolar Junction Transistor
- SOI - Silicon On Insulator
- LVT - Low-Voltage Threshold
- HVT - High-Voltage Threshold
- GAA - Gate-All-Around
- FEOL - Front-End of Line
- BEOL - Back-End of Line
- CMP - Chemical Mechanical Polishing
- CVD - Chemical Vapour Deposition
- PVD - Physical Vapour Deposition
- LPCVD - Low-Pressure Chemical Vapour Deposition
- EMIB - Embedded Multi-Die Interconnect Bridge
Memory & Storage:
- SRAM - Static Random Access Memory
- DRAM - Dynamic Random Access Memory
- HBM - High-Bandwidth Memory
- ROM - Read-Only Memory
- EEPROM - Electrically Erasable Programmable Read-Only Memory
- NVM - Non-Volatile Memory
Testing & Verification:
- DFT - Design for Testability
- ATPG - Automatic Test Pattern Generation
- JTAG - Joint Test Action Group
- BIST - Built-In Self-Test
- MBIST - Memory Built-In Self-Test
- LBIST - Logic Built-In Self-Test
EDA (Electronic Design Automation) & Design Flow:
- EDA - Electronic Design Automation
- PDK - Process Design Kit
- GDSII - Graphic Data System II
- SPICE - Simulation Program with Integrated Circuit Emphasis
- STA - Static Timing Analysis
- CTS - Clock Tree Synthesis
- DRC - Design Rule Check
- LVS - Layout vs Schematic
- P&R - Place and Route
- UPF - Unified Power Format
Packaging & Interconnects:
- TSV - Through-Silicon Via
- BGA - Ball Grid Array
- QFP - Quad Flat Package
- WLP - Wafer-Level Packaging
- MCM - Multi-Chip Module
Power & Performance:
- PPA - Power, Performance, and Area
- DVFS - Dynamic Voltage and Frequency Scaling
- IR - IR Drop (Voltage Drop due to Resistance)
- EM - Electromigration
Semiconductor Chemicals & Materials:
- Si - Silicon
- GaAs - Gallium Arsenide
- MoS2 - Molybdenum Disulfide
- SiO₂ - Silicon Dioxide
- Si₃N₄ - Silicon Nitride
- POCl₃ - Phosphorus Oxychloride
- BF₃ - Boron Trifluoride
- H₃PO₄ - Phosphoric Acid
- HF - Hydrofluoric Acid
- KOH - Potassium Hydroxide
- HNO₃ - Nitric Acid
- H₂O₂ - Hydrogen Peroxide
- NH₄OH - Ammonium Hydroxide
- WF₆ - Tungsten Hexafluoride
- AlCl₃ - Aluminum Chloride
- Cl₂ - Chlorine Gas
